Kyung-Moon Kim

Title: **Innovator Spotlight: Kyung-Moon Kim**

Introduction

Kyung-Moon Kim, a prominent inventor based in Ichon-si, South Korea, has made significant contributions to the field of semiconductor technology. With a portfolio of seven patents, he stands at the forefront of innovations in flip chip packaging and metallurgical interconnections.

Latest Patents

Kim's latest patents revolve around advanced semiconductor devices and methods for enhancing the interconnection between chips and substrates in flip chip packages. One notable patent details a method for forming metallurgical interconnections and ensuring polymer adhesion between a chip and substrate. This process involves aligning a chip, which has bumps on one side, with a substrate that possesses interconnect points. The method includes providing a specific amount of polymer adhesive, pressing the chip and substrate together, and applying heat to create a metallurgical connection. Notably, these connections are formed using an alloy of gold and tin, effectively enhancing the reliability of the electrical connections.

Another patent similarly addresses the interconnection of chips and substrates, using pure metal bumps and spots to create strong metallurgical bonds. His innovative techniques are central to the development of reliable flip chip packages.

Career Highlights

Throughout his career, Kyung-Moon Kim has worked with notable companies in the semiconductor industry, including Chippac, Inc. and Stats Chippac Pte. Ltd. His experiences in these leading firms have further honed his expertise and contributed to his role as an influential figure in semiconductor innovations.

Collaborations

Kim has collaborated with esteemed professionals such as Rajendra D. Pendse and Nazir Ahmad. These partnerships have fostered a fruitful exchange of ideas and have propelled advancements in the field of semiconductor technology.

Conclusion

Kyung-Moon Kim's innovations in semiconductor devices and interconnection methods showcase his commitment to enhancing technology within the industry. His contributions, marked by multiple patents and collaborations, underscore his status as a leading inventor in the field. These advancements not only reflect his technical ingenuity but also pave the way for future breakthroughs in semiconductor technology.