The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Oct. 07, 2011
Nazir Ahmad, San Jose, CA (US);
Young-do Kweon, Cupertino, CA (US);
Samuel Tam, Daly City, CA (US);
Kyung-moon Kim, Kyoung ki-do, KR;
Rajendra D. Pendse, Fremont, CA (US);
Nazir Ahmad, San Jose, CA (US);
Young-Do Kweon, Cupertino, CA (US);
Samuel Tam, Daly City, CA (US);
Kyung-Moon Kim, Kyoung ki-do, KR;
Rajendra D. Pendse, Fremont, CA (US);
STATS ChipPAC, Ltd., Singapore, SG;
Abstract
A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points.