Geun Sik Kim

Title: Innovations by Geun Sik Kim: A Glimpse into His Patented Technologies

Introduction

Geun Sik Kim, an accomplished inventor based in Gilbert, Arizona, has made significant contributions to the field of integrated circuit packaging. With a total of six patents to his name, his work showcases innovative solutions that address key challenges in semiconductor technology.

Latest Patents

Among Kim's notable patents is the "Integrated Circuit Package System." This invention outlines an integrated circuit package structure that includes a leadframe with leads designed to establish electrical contact between an integrated circuit chip and an external electrical source. The configuration includes outer leads, down set transitional leads, and down set inner leads, which play a critical role in connecting the integrated circuit chip to the down set inner leads. Additionally, the design incorporates an encapsulating material that safeguards the down set inner leads from exposure, enhancing the reliability of the package.

Another significant patent is the "Semiconductor Flip Chip Package Having Substantially Non-Collapsible Spacer and Method of Manufacture Thereof." This invention describes a flip chip lead frame package that consists of a die and a lead frame featuring a die paddle and leads. The integration of a spacer helps maintain an essential separation between the die and the die paddle, and the patent also elaborates on methods for manufacturing this advanced package.

Career Highlights

Throughout his career, Geun Sik Kim has held positions in reputable companies within the semiconductor industry, including Stats Chippac and Chippac, Inc. His expertise and innovative mindset have propelled him to the forefront of technology development in this sector.

Collaborations

Kim has had the opportunity to work alongside notable colleagues such as Jae Soo Lee and Robinson Quiazon. Such collaborations have likely enriched his inventive process, leading to the successful development of his patented technologies.

Conclusion

Geun Sik Kim's six patents represent a remarkable contribution to the field of integrated circuit packaging. His innovative designs not only address existing challenges but also pave the way for advancements in semiconductor technology. As the industry continues to evolve, Kim’s contributions will undoubtedly remain influential in shaping future developments in the field.