The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Sep. 29, 2010
Applicants:

Frederick Rodriguez Dahilig, Singapore, SG;

Sheila Marie L. Alvarez, Singapore, SG;

Antonio B. Dimaano, Jr., Singapore, SG;

Dioscoro A. Merilo, Singapore, SG;

Inventors:

Frederick Rodriguez Dahilig, Singapore, SG;

Sheila Marie L. Alvarez, Singapore, SG;

Antonio B. Dimaano, Jr., Singapore, SG;

Dioscoro A. Merilo, Singapore, SG;

Assignee:

Stats Chippac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/41 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacture of an integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system.


Find Patent Forward Citations

Loading…