The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Feb. 08, 2011
Applicants:
Byung Tai DO, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Inventors:
Byung Tai Do, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/49 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes: a semiconductor chip; a stress-relieving layer on the semiconductor chip; an adhesion layer on the stress relieving layer; and electrical interconnects bonded to the adhesion layer.
Do, Byung. (2013). Integrated circuit package system with warp-free chip (U.S. Patent No. 8421197). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8421197
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile