The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
May. 01, 2008
Seng Guan Chow, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Dioscoro A. Merilo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Seng Guan Chow, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Dioscoro A. Merilo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A stackable integrated circuit package system includes: forming a first integrated circuit die having a small interconnect and a large interconnect provided thereon; forming an external interconnect, having an upper tip and a lower tip, from a lead frame; mounting the first integrated circuit die on the external interconnect with the small interconnect on the lower tip and below the upper tip; and encapsulating around the small interconnect and around the large interconnect with an exposed surface.