The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Jul. 05, 2007
Applicants:
Leocadio M. Alabin, Singapore, SG;
Librado Gatbonton, Singapore, SG;
Chiu Hsieh Ong, Singapore, SG;
Beng Yee Teh, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Inventors:
Leocadio M. Alabin, Singapore, SG;
Librado Gatbonton, Singapore, SG;
Chiu Hsieh Ong, Singapore, SG;
Beng Yee Teh, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.