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For the Inventor, By the Inventor

Singapore, Singapore

Leocadio Morona Alabin

This inventor holds 14 USPTO granted patents and 7 published patent applications. Top assignees: Fairchild Semiconductor Corporation, Stats Chippac Pte. Ltd.. Active years: 2009-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leocadio Morona Alabin. Retrieved from https://idiyas.com/inventor/leocadio-morona-alabin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 85.7

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 28(Granted Patents)


Location History:

  • Singapore, SG (2009 - 2012)
  • Singapore, PH (2012)

Company Filing History:

goldMedal12 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
silverMedal2 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2009-2012

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14 patents (USPTO):Explore Patents
1. 8314480 - Stackable semiconductor package with embedded die in pre-molded carrier frame (2012-11-20),
2. 8274145 - Semiconductor package system with patterned mask over thermal relief (2012-09-25),
3. 8268671 - Semiconductor system-in-package and methods for making the same (2012-09-18),
4. 8198132 - Isolated stacked die semiconductor packages (2012-06-12),
5. 8072051 - Folded lands and vias for multichip semiconductor packages (2011-12-06),
6. 8053883 - Isolated stacked die semiconductor packages (2011-11-08),
7. 7977776 - Multichip discrete package (2011-07-12),
8. 7960211 - Semiconductor system-in-package and method for making the same (2011-06-14),
9. 7944031 - Leadframe-based chip scale semiconductor packages (2011-05-17),
10. 7923847 - Semiconductor system-in-a-package containing micro-layered lead frame (2011-04-12),
11. 7888781 - Micro-layered lead frame semiconductor packages (2011-02-15),
12. 7846773 - Multi-chip semiconductor package (2010-12-07),
13. 7843048 - Multi-chip discrete devices in semiconductor packages (2010-11-30),
14. 7498665 - Integrated circuit leadless package system (2009-03-03),

Title: Leocadio Morona Alabin - Pioneering Inventor from Singapore

Introduction: Leocadio Morona Alabin is a renowned inventor hailing from Singapore, known for his groundbreaking innovations in various fields.

Latest Patents: Leocadio Morona Alabin holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise.

Career Highlights: Throughout his illustrious career, Leocadio Morona Alabin has consistently pushed the boundaries of innovation, with his inventions revolutionizing industries and improving the lives of many.

Collaborations: Leocadio Morona Alabin has collaborated with leading research institutions, universities, and companies worldwide, demonstrating his commitment to fostering innovation through partnerships.

Conclusion: Leocadio Morona Alabin's contributions to the world of inventions and innovations have left an indelible mark, solidifying his legacy as a visionary inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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