The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Nov. 24, 2008
Manolito Galera, Etobicoke, CA;
Leocadio Morona Alabin, Singapore, SG;
Manolito Galera, Etobicoke, CA;
Leocadio Morona Alabin, Singapore, SG;
Fairchild Semiconductor Corporation, , CA (US);
Abstract
Chip scale semiconductor packages and methods for making and using the same are described. The chip scale semiconductor packages comprise a leadframe supporting a die that contains a discrete device. The chip scale semiconductor device also contains and an interconnect structure that also serves as a land for the package. The leadframe contains a topset feature adjacent a die attach pad supporting the die, a configuration which provides a connection to the interconnect structure as well as the backside of the die. This leadframe configuration provides a maximum die size to be used in the chip scale semiconductor packages while allowing them to be used in low power and ultra-portable electronic devices. Other embodiments are described.