The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
May. 05, 2008
Manolito Galera, Singapore, SG;
Leocadio Morona Alabin, Singapore, SG;
Manolito Galera, Singapore, SG;
Leocadio Morona Alabin, Singapore, SG;
Fairchild Semiconductor Corporation, , DE (US);
Abstract
Semiconductor packages that contain multiple dies containing discrete devices and methods for making such devices are described. The semiconductor package contains both a first die containing transistor and second die containing a diode. The interconnect lead of the semiconductor package is connected to the bond pad of the transistor. At the same time, the interconnect lead contains a die attach pad for the diode. The result of this configuration is an integrated functional semiconductor device with a diminished footprint and decreased cost of manufacture. By using more than a single die containing a discrete device in a single semiconductor package, the device can also provide a wider variety of functions. Other embodiments are also described.