The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2009

Filed:

May. 04, 2006
Applicants:

Leocadio M. Alabin, Singapore, SG;

IL Kwon Shim, Singapore, SG;

Henry D. Bathan, Singapore, SG;

Jeffrey D. Punzalan, Singapore, SG;

Inventors:

Leocadio M. Alabin, Singapore, SG;

Il Kwon Shim, Singapore, SG;

Henry D. Bathan, Singapore, SG;

Jeffrey D. Punzalan, Singapore, SG;

Assignee:

Stats Chippac Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.


Find Patent Forward Citations

Alabin, Leocadio. (2009). Integrated circuit leadless package system (U.S. Patent No. 7498665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7498665

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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