This inventor holds 2 USPTO granted patents. Top assignees: Stats Chippac Pte. Ltd., United Test and Assembly Center Limited. Active years: 2012-2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
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Years Active: 2012-2014
Title: The Innovations of Librado Amurao Gatbonton
Introduction
Librado Amurao Gatbonton is a notable inventor based in Singapore, known for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in the field of semiconductor packaging.
Latest Patents
Gatbonton's latest patents include a method for packaging semiconductor devices. This innovative method involves forming a device stack by temporarily mounting a first chip to a temporary substrate. The first chip's top surface features interconnects, while a second chip is stacked on top, with conductive contacts that bond to the first chip. His second patent focuses on a semiconductor package system that utilizes a patterned mask over thermal relief, enhancing the efficiency of semiconductor die attachment.
Career Highlights
Throughout his career, Gatbonton has worked with prominent companies such as United Test and Assembly Center Limited and Stats Chippac Pte. Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Gatbonton has collaborated with notable coworkers, including Chin Hock Toh and Keng Yuen Au, further enriching his professional journey and contributions to the field.
Conclusion
Librado Amurao Gatbonton stands out as an influential inventor in the semiconductor industry, with his innovative patents and collaborative efforts shaping the future of technology. His work continues to impact the field significantly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile