The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Dec. 13, 2006
Applicants:
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Inventors:
Seng Guan Chow, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; processing a top edge of the support structure along an outermost periphery thereof, to include a recess for preventing mold bleed, the recess surrounded by the lead finger system; and encapsulating the recess and the electrical interconnect system with an encapsulation material to interlock the encapsulation material.