The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
May. 10, 2010
Seng Guan Chow, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Dioscoro A. Merilo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Seng Guan Chow, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Dioscoro A. Merilo, Singapore, SG;
Antonio B. Dimaano, Jr., Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A stackable integrated circuit package system includes: a substrate having a first side and a second side opposite the first side, the substrate having a cavity provided therein; a first integrated circuit die in the cavity with a first interconnect extending out from the cavity without connection and a second interconnect connected to the first side; a first mold compound to cover the first integrated circuit die, the second interconnect, and a portion of the first interconnect; a second integrated circuit die mounted to the first integrated circuit die with a third interconnect connected to the second side; a second mold compound to cover the second integrated circuit die and the third interconnect; and external interconnects, not encapsulated by the second encapsulant, mounted on the second side.