The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Nov. 20, 2007
Dario S. Filoteo, Jr., Singapore, SG;
Emmanuel A. Espiritu, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Emmanuel A. Espiritu, Singapore, SG;
Stats Chippac, Inc., Fremont, CA (US);
Abstract
A method for electrically connecting an integrated circuit to a via in a substrate is disclosed. The method can include deforming a ball over the via to form a bump and attaching a bond wire to the bump. The method also can include attaching the bond wire to the integrated circuit, such as by forming an end of the bond wire into a second ball and deforming the second ball over the integrated circuit. Alternatively, the method can include forming an end of the bond wire into a ball and deforming the ball over the via. Embodiments of a disclosed integrated circuit and substrate assembly can include, for example, a bump aligned with at least a portion of a via in a substrate and a bond wire attached to the integrated circuit and the bump. Other embodiments can include a via with a top metal cap and an upper plating.