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For the Inventor, By the Inventor

Singapore, Singapore

Byung Hoon Ahn

This inventor holds 12 USPTO granted patents and 2 published patent applications. Top assignees: St Assembly Test Services Inc., Amkor Technology, Inc., Stats Chippac Pte. Ltd.. Active years: 2005-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung Hoon Ahn. Retrieved from https://idiyas.com/inventor/byung-hoon-ahn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 75.0

Average Co-Inventor Count = 2.8

ph-index = 7

Forward Citations = 171(Granted Patents)


Location History:

  • Singapore, SG (2005 - 2013)
  • Seoul, KR (2016)

Company Filing History:

goldMedal7 out of 103 
 
St Assembly Test Services Inc.
 patents
silverMedal3 out of 1,009 
 
Amkor Technology, Inc.
 patents
bronzeMedal2 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2005-2016

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12 patents (USPTO):Explore Patents
1. 9362210 - Leadframe and semiconductor package made using the leadframe (2016-06-07),
2. 8536688 - Integrated circuit leadframe and fabrication method therefor (2013-09-17),
3. 8410585 - Leadframe and semiconductor package made using the leadframe (2013-04-02),
4. 7960816 - Semiconductor package with passive device integration (2011-06-14),
5. 7833840 - Integrated circuit package system with down-set die pad and method of manufacture thereof (2010-11-16),
6. 7205651 - Thermally enhanced stacked die package and fabrication method (2007-04-17),
7. 7135760 - Moisture resistant integrated circuit leadframe package (2006-11-14),
8. 7091596 - Semiconductor packages and leadframe assemblies (2006-08-15),
9. 7064420 - Integrated circuit leadframe with ground plane (2006-06-20),
10. 7042068 - Leadframe and semiconductor package made using the leadframe (2006-05-09),
11. 7005325 - Semiconductor package with passive device integration (2006-02-28),
12. 6858470 - Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof (2005-02-22),

Title: Inventor Byung Hoon Ahn - Revolutionizing Technology in Singapore

Introduction: Byung Hoon Ahn is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Byung Hoon Ahn holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Byung Hoon Ahn has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the world of innovation.

Collaborations: Byung Hoon Ahn has collaborated with top scientists, engineers, and researchers from around the globe, fostering a culture of creativity and excellence in all his projects.

Conclusion: Byung Hoon Ahn's relentless pursuit of innovation and his passion for creating a better future through technology make him a true pioneer in the field of inventing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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