The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Dec. 08, 2004
Applicants:
Byung Hoon Ahn, Singapore, SG;
Pandi Chelvam Marimuthu, Singapore, SG;
Inventors:
Byung Hoon Ahn, Singapore, SG;
Pandi Chelvam Marimuthu, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit leadframe and a fabrication method for fabricating the integrated circuit leadframe include forming a leadframe having leads around a die pad that has a peripheral die pad rim. A discrete, alternately staggered surface configuration is formed in the die pad rim. The discrete, alternately staggered surface configuration creates space in the die pad for connecting and separating ground bond wire-bonds and down bond wire-bonds, and provides for locking encapsulant firmly to the die pad.