The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Feb. 05, 2004
Applicants:
Seng Guan Chow, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Ming Ying, Singapore, SG;
Byung Hoon Ahn, Singapore, SG;
Inventors:
Seng Guan Chow, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Ming Ying, Singapore, SG;
Byung Hoon Ahn, Singapore, SG;
Assignee:
St Assembly Test Services Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.