The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Dec. 23, 2005
Applicants:
Lun Zhao, London, GB;
Wan Lay Looi, Johor Baharu, MY;
Kyaw Oo Aung, Singapore, SG;
Yonggang Jin, Singapore, SG;
Jae-yong Song, Singapore, SG;
Won Sun Shin, Suwon, KR;
Inventors:
Lun Zhao, London, GB;
Wan Lay Looi, Johor Baharu, MY;
Kyaw Oo Aung, Singapore, SG;
Yonggang Jin, Singapore, SG;
Jae-Yong Song, Singapore, SG;
Won Sun Shin, Suwon, KR;
Assignee:
ST Assembly Test Services Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.