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For the Inventor, By the Inventor

Singapore, Singapore

Kyaw Oo Aung

USPTO Granted Patents = 3 

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Clementi, SG (2006)
  • Singapore, SG (2008 - 2016)

Company Filing History:

goldMedal2 out of 103 
 
St Assembly Test Services Inc.
 patents
silverMedal1 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2006-2016

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3 patents (USPTO):Explore Patents
1. 9281274 - Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof (2016-03-08),
2. 7443039 - System for different bond pads in an integrated circuit package (2008-10-28),
3. 7005370 - Method of manufacturing different bond pads on the same substrate of an integrated circuit package (2006-02-28),
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