The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
May. 13, 2004
Lun Zhao, London, GB;
Wan Lay Looi, Jahore, MY;
Kyaw Oo Aung, Clementi, SG;
Yonggang Jin, Singapore, SG;
Jae-yong Song, Singapore, SG;
Won Sun Shin, Suwon, KR;
Lun Zhao, London, GB;
Wan Lay Looi, Jahore, MY;
Kyaw Oo Aung, Clementi, SG;
Yonggang Jin, Singapore, SG;
Jae-Yong Song, Singapore, SG;
Won Sun Shin, Suwon, KR;
ST Assembly Test Services Ltd., Singapore, SG;
Abstract
A method for manufacturing an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.