Location History:
- Jahore, MY (2006)
- Singapore, SG (2008)
- Johor, MY (2011)
- Johor Baharu, MY (2008 - 2012)
Company Filing History:
Years Active: 2006-2012
Title: Innovations of Wan Lay Looi
Introduction
Wan Lay Looi is a notable inventor based in Johor Baharu, Malaysia. He has made significant contributions to the field of integrated circuit systems, holding a total of 5 patents. His work reflects a deep understanding of electronic engineering and innovation.
Latest Patents
Among his latest patents is an integrated circuit system featuring a metal-insulator-metal circuit element. This invention includes the formation of a substrate, a first contact with multiple conductive layers, a dielectric layer, and a second contact on the dielectric layer. Another significant patent is for an integrated circuit package system with a bump pad, which involves forming a patterned redistribution pad over the integrated circuit. These patents showcase his expertise in developing advanced electronic components.
Career Highlights
Wan Lay Looi has worked with prominent companies in the industry, including Stats Chippac Pte. Ltd. and St Assembly Test Services Inc. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Throughout his career, Wan Lay Looi has collaborated with talented individuals such as Yaojian Lin and Haijing Cao. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Wan Lay Looi's contributions to the field of integrated circuits and his impressive portfolio of patents highlight his role as a leading inventor in Malaysia. His work continues to influence the electronics industry and inspire future innovations.