Stats Chippac Pte. Ltd.

St Assembly Test Services Inc.

Wan Lay Looi

Yaojian Lin

Haijing Cao

Yonggang Jin

Won Sun Shin

Kyaw Oo Aung

Jae-Yong Song

Lun Zhao

Byung Tai Do

Romeo Emmanuel P Alvarez

Eng Seng Lim

An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric layer on the first contact, and forming a second contact on the dielectric layer and over the first contact.

Integrated circuit system with metal-insulator-metal circuit element

An integrated circuit package system includes an integrated circuit, and forming a patterned redistribution pad over the integrated circuit.

Integrated circuit package system with bump pad

An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.

System for different bond pads in an integrated circuit package

An integrated circuit system provides a precursor for an integrated wire bond and flip chip structure. The precursor has a plurality of contact pads thereon. A layer of titanium is deposited on the precursor. A layer of nickel-vanadium is deposited on the layer of titanium. A layer of copper is deposited on the layer of nickel-vanadium. A mask is formed on at least a portion of the layer of copper. Portions of the layers of copper and nickel-vanadium not protected by the mask are removed to expose portions of the layer of titanium. The exposed portions of the layer of titanium are etched with an etching solution consisting of an etchant, a viscosity modifier, and an oxidizer.

Integrated circuit system for bonding

A method for manufacturing an integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is formed over the substrate. A second metallurgy layer is formed over the first metallurgy layer. The first metallurgy layer is removed while leaving a portion thereof over the second contact pad. The second metallurgy layer is removed while leaving a portion thereof over the second contact pad. A protective layer is formed over the first contact pad while removing the first metallurgy layer.

Growing community of inventors

Johor Baharu, Malaysia

Wan Lay Looi