Company Filing History:
Years Active: 2006-2008
Title: Jae-Yong Song: Innovator in Integrated Circuit Technology
Introduction
Jae-Yong Song is a prominent inventor based in Singapore, known for his contributions to integrated circuit technology. With a total of 2 patents, he has made significant advancements in the field, particularly in the design and manufacturing of integrated circuit packages.
Latest Patents
His latest patents include a "System for different bond pads in an integrated circuit package." This innovation provides a substrate with first and second contact pads that are exposed through a passivation layer. The design features a first metallurgy layer over the substrate and a second metallurgy layer over the first. Additionally, a protective layer is placed over the first contact pad. Another notable patent is the "Method of manufacturing different bond pads on the same substrate of an integrated circuit package." This method outlines a process for creating an integrated circuit package with similar features, emphasizing the removal of specific metallurgy layers while maintaining portions over the contact pads.
Career Highlights
Jae-Yong Song is currently employed at St Assembly Test Services Inc., where he continues to innovate in the field of integrated circuits. His work has been instrumental in enhancing the efficiency and functionality of electronic devices.
Collaborations
He has collaborated with notable coworkers Lun Zhao and Wan Lay Looi, contributing to various projects that push the boundaries of integrated circuit technology.
Conclusion
Jae-Yong Song's contributions to integrated circuit technology through his patents and work at St Assembly Test Services Inc. highlight his role as a key innovator in the field. His advancements continue to influence the development of modern electronic devices.