Company Filing History:
Years Active: 2006-2008
Title: Lun Zhao - Innovator in Integrated Circuit Technology
Introduction
Lun Zhao is a prominent inventor based in London, GB, known for his contributions to integrated circuit technology. With a total of 2 patents, he has made significant advancements in the field, particularly in the design and manufacturing of integrated circuit packages.
Latest Patents
Lun Zhao's latest patents include a "System for different bond pads in an integrated circuit package." This innovation provides an integrated circuit package with a substrate that has first and second contact pads exposed through a passivation layer. A first metallurgy layer is applied over the substrate, followed by a second metallurgy layer. Additionally, a protective layer is placed over the first contact pad. Another notable patent is the "Method of manufacturing different bond pads on the same substrate of an integrated circuit package." This method outlines a process for creating an integrated circuit package with a substrate featuring first and second contact pads. The process involves forming a first metallurgy layer over the substrate and a second metallurgy layer over the first. The first metallurgy layer is then partially removed, leaving a portion over the second contact pad, while the second metallurgy layer is also partially removed. A protective layer is formed over the first contact pad during this process.
Career Highlights
Lun Zhao is currently employed at St Assembly Test Services Inc., where he continues to innovate and contribute to the field of integrated circuits. His work has been instrumental in enhancing the efficiency and functionality of integrated circuit packages.
Collaborations
Lun Zhao collaborates with talented individuals such as Wan Lay Looi and Kyaw Oo Aung, who contribute to the innovative environment at St Assembly Test Services Inc.
Conclusion
Lun Zhao's work in integrated circuit technology showcases his dedication to innovation and excellence. His patents reflect a commitment to advancing the field and improving the design and manufacturing processes of integrated circuits.