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For the Inventor, By the Inventor

Singapore, Singapore

Jae Hun Ku

This inventor holds 29 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Amkor Technology, Inc., Stats Chippac Pte. Ltd., St Assembly Test Services Inc.. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Hun Ku. Retrieved from https://idiyas.com/inventor/jae-hun-ku

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 89.7

Average Co-Inventor Count = 3.9

ph-index = 12

Forward Citations = 816(Granted Patents)


Location History:

  • Singapore, KR (2005)
  • Signapore, SG (2006)
  • Seoul, KR (2002 - 2016)
  • Singapore, SG (2004 - 2017)

Company Filing History:

goldMedal13 out of 1,009 
 
Amkor Technology, Inc.
 patents
silverMedal9 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents
bronzeMedal7 out of 103 
 
St Assembly Test Services Inc.
 patents

Years Active: 2002-2017

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Areas of Expertise:
TSV Interconnects
Leadframe
Integrated Circuit
Encapsulation
Large Die Structures
Interconnect Structure
Semiconductor Device
Stacked Chips
Manufacturing Method
Thermal Management
Insulating Layer
Structural Support
29 patents (USPTO):Explore Patents
1. 9837336 - Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief (2017-12-05),
2. 9601462 - Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer (2017-03-21),
3. 9362210 - Leadframe and semiconductor package made using the leadframe (2016-06-07),
4. 9224647 - Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer (2015-12-29),
5. 9054083 - Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support (2015-06-09),
6. 8809191 - Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer (2014-08-19),
7. 8742591 - Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief (2014-06-03),
8. 8659162 - Semiconductor device having an interconnect structure with TSV using encapsulant for structural support (2014-02-25),
9. 8410585 - Leadframe and semiconductor package made using the leadframe (2013-04-02),
10. 8399306 - Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof (2013-03-19),
11. 8067308 - Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support (2011-11-29),
12. 8035204 - Large die package structures and fabrication method therefor (2011-10-11),
13. 7700404 - Large die package structures and fabrication method therefor (2010-04-20),
14. 7564122 - Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant (2009-07-21),
15. 7413933 - Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor (2008-08-19),

Title: Inventor Jae Hun Ku - Revolutionizing Technology in Singapore

Introduction: Jae Hun Ku is a pioneering inventor based in Singapore, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jae Hun Ku holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Jae Hun Ku has worked with leading tech companies and research institutions to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout her career, Jae Hun Ku has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing.

Conclusion: Jae Hun Ku's dedication to pushing the boundaries of technology and her passion for creating a more sustainable world make her a true visionary in the field of invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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