Company Filing History:

13 out of 1,009

Amkor Technology, Inc.

patents

9 out of 1,812

Stats Chippac Pte. Ltd.

patents

7 out of 103

St Assembly Test Services Inc.

patents

Years Active: 2002-2017

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29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9837336 - Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief (2017-12-05),

2. 9601462 - Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer (2017-03-21),

3. 9362210 - Leadframe and semiconductor package made using the leadframe (2016-06-07),

4. 9224647 - Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer (2015-12-29),

5. 9054083 - Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support (2015-06-09),

6. 8809191 - Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer (2014-08-19),

7. 8742591 - Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief (2014-06-03),

8. 8659162 - Semiconductor device having an interconnect structure with TSV using encapsulant for structural support (2014-02-25),

9. 8410585 - Leadframe and semiconductor package made using the leadframe (2013-04-02),

10. 8399306 - Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof (2013-03-19),

11. 8067308 - Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support (2011-11-29),

12. 8035204 - Large die package structures and fabrication method therefor (2011-10-11),

13. 7700404 - Large die package structures and fabrication method therefor (2010-04-20),

14. 7564122 - Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant (2009-07-21),

15. 7413933 - Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor (2008-08-19),

Title: Inventor Jae Hun Ku - Revolutionizing Technology in Singapore

Introduction: Jae Hun Ku is a pioneering inventor based in Singapore, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jae Hun Ku holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Jae Hun Ku has worked with leading tech companies and research institutions to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout her career, Jae Hun Ku has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing.

Conclusion: Jae Hun Ku's dedication to pushing the boundaries of technology and her passion for creating a more sustainable world make her a true visionary in the field of invention.

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