Company Filing History:

13 out of 1,009

Amkor Technology, Inc.

patents

9 out of 1,812

Stats Chippac Pte. Ltd.

patents

7 out of 103

St Assembly Test Services Inc.

patents

Years Active: 2002-2017

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29 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9837336 - Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief (2017-12-05),

2. 9601462 - Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer (2017-03-21),

3. 9362210 - Leadframe and semiconductor package made using the leadframe (2016-06-07),

4. 9224647 - Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer (2015-12-29),

5. 9054083 - Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support (2015-06-09),

6. 8809191 - Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer (2014-08-19),

7. 8742591 - Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief (2014-06-03),

8. 8659162 - Semiconductor device having an interconnect structure with TSV using encapsulant for structural support (2014-02-25),

9. 8410585 - Leadframe and semiconductor package made using the leadframe (2013-04-02),

10. 8399306 - Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof (2013-03-19),

11. 8067308 - Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support (2011-11-29),

12. 8035204 - Large die package structures and fabrication method therefor (2011-10-11),

13. 7700404 - Large die package structures and fabrication method therefor (2010-04-20),

14. 7564122 - Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant (2009-07-21),

15. 7413933 - Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor (2008-08-19),

Title: Inventor Jae Hun Ku - Revolutionizing Technology in Singapore

Introduction: Jae Hun Ku is a pioneering inventor based in Singapore, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jae Hun Ku holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Jae Hun Ku has worked with leading tech companies and research institutions to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout her career, Jae Hun Ku has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing.

Conclusion: Jae Hun Ku's dedication to pushing the boundaries of technology and her passion for creating a more sustainable world make her a true visionary in the field of invention.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.