The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Mar. 25, 2011
Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
Applicants:
Junmo Koo, Singapore, SG;
Pandi Chelvam Marimuthu, Singapore, SG;
Jae Hun Ku, Singapore, SG;
Jose Alvin Caparas, Singapore, SG;
Shariff Dzafir, Singapore, SG;
Inventors:
JunMo Koo, Singapore, SG;
Pandi Chelvam Marimuthu, Singapore, SG;
Jae Hun Ku, Singapore, SG;
Jose Alvin Caparas, Singapore, SG;
Shariff Dzafir, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.