Shariff Dzafir

Title: Innovations by Shariff Dzafir in Integrated Circuit Packaging

Introduction

Shariff Dzafir is a notable inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the functionality and visibility of integrated circuits.

Latest Patents

Shariff Dzafir holds a patent for an "Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof." This patent describes a method of manufacturing an integrated circuit packaging system that includes forming a substrate with a redistribution line, mounting an integrated circuit to the substrate, and molding a transparent encapsulation over the substrate. This encapsulation allows the integrated circuit and redistribution line to be visible through the transparent material, providing both protection and aesthetic appeal.

Career Highlights

Shariff Dzafir is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in advancing the technology used in integrated circuits, making them more efficient and reliable.

Collaborations

Throughout his career, Shariff has collaborated with talented professionals such as JunMo Koo and Pandi Chelvam Marimuthu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Shariff Dzafir's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement in technology, showcasing the importance of transparency in circuit design.