Chandler, AZ, United States of America

Kambhampati Ramakrishna


Average Co-Inventor Count = 3.0

ph-index = 15

Forward Citations = 1,017(Granted Patents)


Location History:

  • Tempe, AZ (US) (2005)
  • Chandler, AZ (US) (2002 - 2013)

Company Filing History:


Years Active: 2002-2013

Loading Chart...
31 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Kambhampati Ramakrishna

Introduction: Kambhampati Ramakrishna, based in Chandler, AZ, is a prolific inventor renowned for his contributions to the field of semiconductor packaging. With an impressive portfolio of 31 patents, Ramakrishna has made significant advancements that enhance the reliability and efficiency of electronic devices.

Latest Patents: Among his latest innovations are two notable patents that showcase his expertise in heat spreaders and multi-chip package systems. The first patent, titled "Leadframe-based mold array package heat spreader and fabrication method therefor," relates to a heat spreader frame that integrates various components, including heat spreaders with upper surfaces and a peripheral frame supported by stand-off legs. This innovative design reduces the heights of tie bars and optimizes the overall structure by strategically covering the components with a molding compound.

The second patent, "Dual molded multi-chip package system," introduces an embedded integrated circuit package system. It involves a multi-step encapsulation process that effectively protects and connects semiconductor devices, thereby advancing packaging methods in electronics.

Career Highlights: Ramakrishna has carved out a reputable career in the semiconductor industry, with significant tenures at companies such as Stats Chippac Pte. Ltd. and St Assembly Test Services Inc. His work at these firms has enabled him to pioneer innovative packaging solutions that are crucial for modern electronics.

Collaborations: Throughout his career, Ramakrishna has collaborated with talented professionals, including Il Kwon Shim and Seng Guan Chow. These partnerships have contributed to the development of innovative technologies and have expanded the reach of his inventions in the industry.

Conclusion: Kambhampati Ramakrishna's contributions to the world of semiconductor packaging through his extensive patent portfolio continue to impact the industry positively. As technologies evolve, his innovations play a pivotal role in shaping the future of electronic device efficiency and reliability.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…