The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Jun. 04, 2007
Kambhampati Ramakrishna, Chandler, AZ (US);
IL Kwon Shim, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Il Kwon Shim, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Stats Chippac, Inc., Fremont, CA (US);
Abstract
A semiconductor package comprises a semiconductor component (e.g., a die) and a via at least partially covered by an encapsulant. The encapsulant forms substantially parallel top and bottom surfaces, with at least part of the via being exposed on the top surface. At least one conductive pad is exposed on the bottom surface, and the via can electrically couple the top and bottom surfaces, as well as couple the semiconductor component at the top and bottom surfaces. An additional semiconductor component can be coupled to the top surface with a circuit pattern formed on the top surface and coupled to the via.