The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Sep. 28, 2010
Applicants:
IL Kwon Shim, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
Inventors:
Il Kwon Shim, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.