The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
May. 12, 2006
IL Kwon Shim, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Il Kwon Shim, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
STATS ChipPac Ltd., Singapore, SG;
Abstract
An integrated circuit package to package stacking system is provided including providing a first integrated circuit package, having a configured leadframe, providing a second integrated circuit package, having the configured leadframe, and forming an integrated circuit package pair by electrically connecting the configured leadframe of the first integrated circuit package to the configured leadframe of the second integrated circuit package.