The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Sep. 19, 2011
IL Kwon Shim, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile