The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jun. 09, 2008
Seng Guan Chow, Singapore, SG;
IL Kwon Shim, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
Seng Guan Chow, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Byung Joon Han, Singapore, SG;
Kambhampati Ramakrishna, Chandler, AZ (US);
STATS Chippac, Ltd., Singapore, SG;
Abstract
An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.