United Test and Assembly Center Limited

St Assembly Test Services Inc.

Rahamat Bidin

Hien Boon Tan

Hao Liu

Anthony Yi Sheng Sun

Chuen Khiang Wang

Nirmal K Sharma

Clifton Teik Lyk Law

A SIM card is presented. The SIM card includes a support carrier having a first and a second major surface. The support carrier includes a cavity which extends partially into the carrier from the first major surface. The SIM card further includes a chip package disposed within the cavity. The support carrier is sufficiently flexible to bend when the SIM card is being inserted into or removed from a SIM card holder.

Subscriber identity module (SIM) card

A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.

Multi-die IC package and manufacturing method

An embodiment of the invention in a quad flat no-lead package is described. The package is produced by encapsulating an integrated circuit chip, a die pad to which the chip is affixed, and leads which are connected to the chip in a molding compound. Leads are positioned on all four sides of the package, the exposed (bottom) portions of the leads are coplanar with the bottom of the package, and the leads do not extend, or extend only slightly, beyond the area of the package. The package includes a die pad also having an exposed (bottom) portion that is coplanar with the bottom of the package. The top portions of the leads are coplanar with the top surface of the die pad, and are flat.

Leadframe based chip scale package and method of producing the same

Growing community of inventors

Singapore, Singapore

Rahamat Bidin