The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Nov. 14, 2011
Catherine Bee Liang NG, Singapore, SG;
Kriangsak Sae Le, Johor, MY;
Chuen Khiang Wang, Singapore, SG;
Nathapong Suthiwongsunthorn, Singapore, SG;
Catherine Bee Liang Ng, Singapore, SG;
Kriangsak Sae Le, Johor, MY;
Chuen Khiang Wang, Singapore, SG;
Nathapong Suthiwongsunthorn, Singapore, SG;
United Test and Assembly Center Ltd., Singapore, SG;
Abstract
Semiconductor packages and methods of forming a semiconductor package are disclosed. The method includes providing at least one die having first and second surfaces. The second surface of the die includes a plurality of conductive pads. A support carrier is provided and the at least one die is attached to the support carrier. The first surface of the at least one die is facing the support carrier. A cap having first and second surfaces is formed to encapsulate the at least one die. The second surface of the cap is disposed at a different plane than the second surface of the die.