Kriangsak Sae Le

Title: Kriangsak Sae Le: Innovator in Semiconductor Packaging

Introduction

Kriangsak Sae Le is a notable inventor based in Johor Bahru, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a patent that enhances the efficiency of semiconductor packaging.

Latest Patents

Kriangsak holds a patent for "Semiconductor packages and methods of packaging semiconductor devices." This invention discloses a device that includes a carrier substrate with first and second major surfaces. The first surface features a die region and contact pads, while the second surface includes package contacts. The carrier substrate incorporates a patterned lead frame that defines a line level with conductive traces and a via level with via contacts. This design provides essential interconnections between the contact pads and package contacts. Additionally, the carrier substrate is equipped with a dielectric layer that isolates the conductive traces and via contacts. The device also includes a die mounted on the die region of the first surface. Kriangsak's innovative approach in this patent showcases his expertise in semiconductor technology.

Career Highlights

Kriangsak Sae Le is currently employed at United Test and Assembly Center Limited, where he continues to contribute to advancements in semiconductor packaging. His work at this esteemed company highlights his commitment to innovation and excellence in the field.

Collaborations

Kriangsak has collaborated with talented coworkers such as Chuen Khiang Wang and Nathapong Suthiwongsunthorn. These collaborations have further enriched his work and contributed to the success of their projects.

Conclusion

Kriangsak Sae Le is a distinguished inventor whose work in semiconductor packaging has made a significant impact in the industry. His innovative patent reflects his dedication to advancing technology in this field.