Company Filing History:
3 out of 48 
1 out of 69 Years Active: 2010-2017
Title: Mary Annie Cheong: Innovator in Semiconductor Packaging
Introduction
Mary Annie Cheong is a prominent inventor based in Singapore, known for her contributions to the field of semiconductor packaging. With a total of 4 patents to her name, she has made significant strides in developing innovative methods that enhance the manufacturing process of semiconductor devices.
Latest Patents
One of her latest patents is a method of producing a semiconductor package. This method involves manufacturing a lead frame by providing an electrically conductive layer with a plurality of holes at its top surface. These holes form a structure of leads and a die pad on the conductive layer. The holes are filled with a non-conductive material, and an electrically conductive foil is attached to the top surface. The foil is then etched to create a network of leads, die pad, bus lines, dam bars, and tie lines, establishing connections essential for the functionality of semiconductor devices.
Career Highlights
Mary has worked with notable companies such as United Test and Assembly Center Limited and Utac Headquarters Pte. Ltd. Her experience in these organizations has allowed her to refine her skills and contribute to advancements in semiconductor technology.
Collaborations
Throughout her career, Mary has collaborated with talented individuals, including Hien Boon Tan and Anthony Yi Sheng Sun. These partnerships have fostered a creative environment that has led to innovative solutions in her field.
Conclusion
Mary Annie Cheong's work in semiconductor packaging exemplifies her dedication to innovation and excellence. Her patents and career achievements highlight her significant impact on the industry.