The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
May. 02, 2008
Danny Vallejo Retuta, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Susanto Tanary, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Soon Huat James Tan, Singapore, SG;
Danny Vallejo Retuta, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Susanto Tanary, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Soon Huat James Tan, Singapore, SG;
United Test and Assembly Center Ltd., Singapore, SG;
Abstract
A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.