Company Filing History:
Years Active: 2008-2009
Title: Innovations of Soon Huat James Tan
Introduction
Soon Huat James Tan is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging. With a total of 2 patents, his work reflects a commitment to advancing technology in this area.
Latest Patents
One of his latest patents is titled "Leadframe enhancement and method of producing a multi-row semiconductor package." This invention involves a semiconductor package that includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end. Additionally, it features a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. The outer ends of the first leads form a first row along the edge of the package, while the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other, and an encapsulant covers at least a portion of the first and second leads.
Career Highlights
Soon Huat James Tan is currently employed at United Test and Assembly Center Limited. His role in the company allows him to apply his innovative ideas and contribute to the development of advanced semiconductor technologies.
Collaborations
Some of his coworkers include Danny Retuta and Hien Boon Tan. Their collaboration fosters a creative environment that enhances the potential for groundbreaking inventions.
Conclusion
Soon Huat James Tan's contributions to semiconductor packaging through his patents demonstrate his innovative spirit and dedication to technology. His work continues to influence the industry positively.