Singapore, Singapore

Ravi Kanth Kolan

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 225(Granted Patents)


Company Filing History:


Years Active: 2010-2017

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14 patents (USPTO):

Title: Innovations by Ravi Kanth Kolan in Semiconductor Packaging

Introduction

Ravi Kanth Kolan is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor packaging. With a total of 14 patents to his name, Kolan has developed innovative solutions that address critical challenges in the industry. His work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

One of Kolan's latest patents is a packaging structural member designed for use in semiconductor packaging. This structural member includes multiple packaging regions that facilitate the packaging of dies in a wafer format. Each packaging region features a die attach region surrounded by a peripheral region, where a die is securely attached. In one aspect of the invention, the die attach region has openings through the surfaces of the structural member to accommodate a die. Additionally, through-vias are disposed in the peripheral regions, which help reduce warpage that can occur during the curing of the mold compound used in encapsulating the dies. In another aspect, the die attach region may not have an opening, allowing the structural member to serve as an interposer between the die and a substrate.

Career Highlights

Kolan has worked with notable companies in the semiconductor industry, including United Test and Assembly Center Limited and Utac Headquarters Pte. Ltd. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.

Collaborations

Throughout his career, Kolan has collaborated with talented individuals such as Chin Hock Toh and Yi Sheng Anthony Sun. These collaborations have further enriched his work and led to advancements in semiconductor packaging solutions.

Conclusion

Ravi Kanth Kolan's innovative contributions to semiconductor packaging demonstrate his commitment to advancing technology in this critical field. His patents reflect a deep understanding of the challenges faced in semiconductor manufacturing and provide effective solutions to enhance device performance.

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