The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Jun. 05, 2008
Hao Liu, Singapore, SG;
Yi Sheng Anthony Sun, Singapore, SG;
Ravi Kanth Kolan, Singapore, SG;
Chin Hock Toh, Singapore, SG;
Hao Liu, Singapore, SG;
Yi Sheng Anthony Sun, Singapore, SG;
Ravi Kanth Kolan, Singapore, SG;
Chin Hock Toh, Singapore, SG;
United Test and Assembly Center Ltd, Singapore, SG;
Abstract
A method for preparing a die for packaging is disclosed. A die having first and second major surfaces is provided. Vias and a mask layer are formed on the first major surface of the die. The mask includes mask openings that expose the vias. The mask openings are filled with a conductive material. The method includes reflowing to at least partially fill the vias and contact openings to form via contacts in the vias and surface contacts in the mask openings.