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For the Inventor, By the Inventor

Singapore, Singapore

Chin Hock Toh

This inventor holds 19 USPTO granted patents and 3 published patent applications. Top assignees: United Test and Assembly Center Limited, Applied Materials, Inc., Utac Headquarters Pte. Ltd.. Active years: 2011-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin Hock Toh. Retrieved from https://idiyas.com/inventor/chin-hock-toh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 78.9

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 281(Granted Patents)


Company Filing History:

goldMedal14 out of 48 
 
United Test and Assembly Center Limited
 patents
silverMedal4 out of 14,454 
 
Applied Materials, Inc.
 patents
bronzeMedal1 out of 78 
 
Utac Headquarters Pte. Ltd.
 patents

Years Active: 2011-2021

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19 patents (USPTO):Explore Patents
1. 10978334 - Sealing structure for workpiece to substrate bonding in a processing chamber (2021-04-13),
2. 9954051 - Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring (2018-04-24),
3. 9704726 - Packaging structural member (2017-07-11),
4. 9219044 - Patterned photoresist to attach a carrier wafer to a silicon device wafer (2015-12-22),
5. 9202801 - Thin substrate and mold compound handling using an electrostatic-chucking carrier (2015-12-01),
6. 9142487 - Packaging structural member (2015-09-22),
7. 9117808 - Semiconductor packages and methods of packaging semiconductor devices (2015-08-25),
8. 8772921 - Interposer for semiconductor package (2014-07-08),
9. 8741762 - Through silicon via dies and packages (2014-06-03),
10. 8703534 - Semiconductor packages and methods of packaging semiconductor devices (2014-04-22),
11. 8647924 - Semiconductor package and method of packaging semiconductor devices (2014-02-11),
12. 8586465 - Through silicon via dies and packages (2013-11-19),
13. 8426246 - Vented die and package (2013-04-23),
14. 8399985 - Mold design and semiconductor package (2013-03-19),
15. 8384203 - Packaging structural member (2013-02-26),

Title: The Innovative Journey of Chin Hock Toh

Introduction: Chin Hock Toh, a visionary inventor hailing from Singapore, SG, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Chin Hock Toh's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, as well as a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: With a career spanning over two decades, Chin Hock Toh has established himself as a pioneer in the tech industry. His innovative spirit and dedication to creating impactful solutions have led to numerous successful ventures and patents.

Collaborations: Throughout his career, Chin Hock Toh has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Chin Hock Toh's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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