Chin Hock Toh

USPTO Granted Patents = 19 (Patent Applications = 3)

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 273(Granted Patents)

Company Filing History:

14 out of 48

United Test and Assembly Center Limited

patents

4 out of 13,684

Applied Materials, Inc.

patents

1 out of 66

Utac Headquarters Pte. Ltd.

patents

Years Active: 2011-2021

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19 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10978334 - Sealing structure for workpiece to substrate bonding in a processing chamber (2021-04-13),

2. 9954051 - Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring (2018-04-24),

3. 9704726 - Packaging structural member (2017-07-11),

4. 9219044 - Patterned photoresist to attach a carrier wafer to a silicon device wafer (2015-12-22),

5. 9202801 - Thin substrate and mold compound handling using an electrostatic-chucking carrier (2015-12-01),

6. 9142487 - Packaging structural member (2015-09-22),

7. 9117808 - Semiconductor packages and methods of packaging semiconductor devices (2015-08-25),

8. 8772921 - Interposer for semiconductor package (2014-07-08),

9. 8741762 - Through silicon via dies and packages (2014-06-03),

10. 8703534 - Semiconductor packages and methods of packaging semiconductor devices (2014-04-22),

11. 8647924 - Semiconductor package and method of packaging semiconductor devices (2014-02-11),

12. 8586465 - Through silicon via dies and packages (2013-11-19),

13. 8426246 - Vented die and package (2013-04-23),

14. 8399985 - Mold design and semiconductor package (2013-03-19),

15. 8384203 - Packaging structural member (2013-02-26),

Title: The Innovative Journey of Chin Hock Toh

Introduction: Chin Hock Toh, a visionary inventor hailing from Singapore, SG, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Chin Hock Toh's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, as well as a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: With a career spanning over two decades, Chin Hock Toh has established himself as a pioneer in the tech industry. His innovative spirit and dedication to creating impactful solutions have led to numerous successful ventures and patents.

Collaborations: Throughout his career, Chin Hock Toh has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Chin Hock Toh's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors and innovators.

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3 patents pending:

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