The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2014

Filed:

Jan. 10, 2012
Applicants:

Chin Hock Toh, Singapore, SG;

Yao Huang Huang, Singapore, SG;

Ravi Kanth Kolan, Singapore, SG;

Wei Liang Yuan, Singapore, SG;

Susanto Tanary, Singapore, SG;

Yi Sheng Anthony Sun, Singapore, SG;

Inventors:

Chin Hock Toh, Singapore, SG;

Yao Huang Huang, Singapore, SG;

Ravi Kanth Kolan, Singapore, SG;

Wei Liang Yuan, Singapore, SG;

Susanto Tanary, Singapore, SG;

Yi Sheng Anthony Sun, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.


Find Patent Forward Citations

Loading…