Company Filing History:
Years Active: 2012-2014
Title: Yao Huang Huang: Innovator in Semiconductor Technology
Introduction
Yao Huang Huang is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. With a total of 2 patents, he has made significant strides in the field, particularly in the design and functionality of interposers for semiconductor packages.
Latest Patents
His latest patents focus on an innovative interposer for semiconductor packages. The interposer features a base with first and second surfaces, where a redistribution layer is placed on the first surface. It includes at least one interposer pad connected to the redistribution layer and at least one interposer contact on the second surface. The interposer contact is electrically linked to the interposer pad through the redistribution layer. Additionally, the interposer comprises at least one interposer via that connects the interposer contact to the redistribution layer, utilizing reflowed conductive material from the interposer contact.
Career Highlights
Yao Huang Huang is currently employed at United Test and Assembly Center Limited, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the efficiency and performance of semiconductor devices.
Collaborations
He collaborates with notable colleagues, including Chin Hock Toh and Ravi Kanth Kolan, contributing to a dynamic and innovative work environment.
Conclusion
Yao Huang Huang's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor packaging and technology.