The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
May. 05, 2005
Ravi Kanth Kolan, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Beng Kuan Lim, Singapore, SG;
Krishnamoorthi Sivalingam, Singapore, SG;
Ravi Kanth Kolan, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Beng Kuan Lim, Singapore, SG;
Krishnamoorthi Sivalingam, Singapore, SG;
United Test and Assembly Center, Ltd., Singapore, SG;
Abstract
A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free from encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.