Company Filing History:
Years Active: 2010
Title: The Innovations of Beng Kuan Lim
Introduction
Beng Kuan Lim is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit packaging. With a focus on enhancing the structural integrity of electronic components, Lim has made significant strides in technology.
Latest Patents
One of his key patents is titled "Structurally-enhanced integrated circuit package and method of manufacture." This innovative design features a chip scale integrated circuit package that includes an integrated circuit chip with a first and second face. A plurality of pillar bumps are formed on the first face of the chip, while an encapsulant material surrounds the sides and the first face, leaving the upper ends of the pillar bumps free from encapsulant material. This design results in a substantially planar surface formed by the upper surface of the encapsulant material and the upper ends of the pillar bumps. Additionally, a plurality of solder balls are mounted on this planar surface, corresponding to the upper ends of the pillar bumps. Lim holds 1 patent for this innovative technology.
Career Highlights
Beng Kuan Lim is currently employed at United Test and Assembly Center Limited, a company that specializes in providing advanced testing and assembly services for semiconductor products. His work at this organization has allowed him to apply his innovative ideas in practical settings, contributing to the advancement of technology in the semiconductor industry.
Collaborations
Throughout his career, Lim has collaborated with several talented individuals, including his coworkers Ravi Kanth Kolan and Hien Boon Tan. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Beng Kuan Lim's contributions to the field of integrated circuit packaging exemplify the importance of innovation in technology. His patent and work at United Test and Assembly Center Limited highlight his commitment to advancing the semiconductor industry.