The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Dec. 09, 2008
Applicants:
Saravuth Sirinorakul, Bangkok, TH;
Kasemsan Kongthaworn, Patumthani, TH;
Inventors:
Saravuth Sirinorakul, Bangkok, TH;
Kasemsan Kongthaworn, Patumthani, TH;
Assignee:
United Test and Assembly Center Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/565 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 23/49572 (2013.01); H01L 2224/48257 (2013.01); H01L 23/49551 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 24/48 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01);
Abstract
A flip-chip leadframe semiconductor package designed to improve mold flow around the leadframe and semiconductor die. An embodiment of the semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and an encapsulant covering the leadframe and semiconductor die, wherein a portion of the leadframe that is attached to the semiconductor die is below a portion of the leadframe that enters the encapsulant.