Company Filing History:
Years Active: 2006-2012
Title: Wang Chuen Khiang: Innovator in Semiconductor Packaging
Introduction
Wang Chuen Khiang is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor packaging. With a total of five patents to his name, he has made significant advancements in the technology that underpins modern electronic devices.
Latest Patents
Among his latest patents is the "Multiple Die Stack Package," which describes a semiconductor package containing two or more stacked integrated circuit (IC) devices attached to a substrate. Each IC device features multiple electrical contact regions that connect to the substrate through electrical connections. Another notable invention is the "Packaging of a Microchip Device," which focuses on an interposer designed for packaging microchip devices. This interposer includes several electrical contacts on its outer side for connecting to the packaged microchip device, with an aperture extending into the interposer to facilitate connections.
Career Highlights
Wang Chuen Khiang is currently employed at United Test and Assembly Center Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in enhancing the efficiency and reliability of semiconductor packaging solutions.
Collaborations
Wang collaborates with talented coworkers, including Koh Yong Chuan and Fong Kok Chin, who contribute to the innovative environment at United Test and Assembly Center Limited.
Conclusion
Wang Chuen Khiang's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation in technology. His patents reflect a deep understanding of the complexities involved in modern electronic devices, making him a valuable asset to the industry.