The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Jun. 19, 2002
Wang Chuen Khiang, Singapore, SG;
Wang Chuen Khiang, Singapore, SG;
United Test & Assembly Center Limited, Singapore, SG;
Abstract
A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are located to the surface of the microchip devices. Electrical contacts on the microchip device surface are accessible through the aperture in order to electrically connect the electrical contacts with the external electrical contacts of the interposer. The interposer includes separate openings or aperture regions, in particular separated by a bridge, which extend from the interposer surface where the external contacts are located into the interposer. This facilitates the handling of the finalized package and allows for satisfactory filling of the aperture with filling material.